LPKF PCB Through-Hole Electro Plating | ...

LPKF - PCB Through-Hole Electro Plating | Contact S4

PCB Through-Hole Electro Plating | Contact S4

Increasing requirements in rapid PCB prototyping for through-hole plating solutions requires special technologies from LPKF to plate different printed circuit board materials.

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Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The LPKF Contac S4 unites various galvanic and chemical processes in one compact safety housing.

The board is passed through six baths of a bath cascade. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards.

The Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). It offers a subsequent tin bath step for surface protection and improved solderability

Optimized anode plate and pulse reverse plating ensure homogeneous deposition, and carbon activation using black hole technology, integrated air blow-in, and an additional process step for via cleaning ensure reliable connections to the copper surface without the problem of layer detachment. The result is a homogeneous layer thickness in the holes and on the flat metal surface of the substrate.

The integrated touch panel with wizard safely guides even inexperienced users through the galvanization process. The process requires no knowledge of chemistry as the system automatically indicates the necessary maintenance steps.

Max. material size (X x Y)	230 mm x 330 mm (9” x 13”)
Max. layout area (X x Y)	200 mm x 300 mm (7.8” x 11.8”)
Reversing pulse plating	Adjustable
Tolerance	± 2 µm (plated copper)
Minimum hole diameter	≥ 0,2 mm
ViaCleaner	Included
Chemical tinning	Included
Process time	Approx. 90 - 120 min
Electrical consumption	115 / 230 V, 50 - 60 Hz, 0,6 kW
Dimensions (W x H x D)	856 mm x 446 mm x 542 mm (33.7” x 17.5” x 21.3”)
Weight	~ 80 kg unfilled, ~ 115 kg filled

For more information or a quote please call or use the IndustrySearch email enquiry form for a fast direct reply.

To contact Embedded Logic Solutions about LPKF PCB Through-Hole Electro Plating | Contact S4 use Get a quote.

Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The LPKF Contac S4 unites various galvanic and chemical processes in one compact safety housing.

Max. material size (X x Y)	230 mm x 330 mm (9” x 13”)
Max. layout area (X x Y)	200 mm x 300 mm (7.8” x 11.8”)
Reversing pulse plating	Adjustable
Tolerance	± 2 µm (plated copper)
Minimum hole diameter	≥ 0,2 mm
ViaCleaner	Included
Chemical tinning	Included
Process time	Approx. 90 - 120 min
Electrical consumption	115 / 230 V, 50 - 60 Hz, 0,6 kW
Dimensions (W x H x D)	856 mm x 446 mm x 542 mm (33.7” x 17.5” x 21.3”)
Weight	~ 80 kg unfilled, ~ 115 kg filled

For more information or a quote please call or use the IndustrySearch email enquiry form for a fast direct reply.

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To contact Embedded Logic Solutions about LPKF PCB Through-Hole Electro Plating | Contact S4 use Get a quote.

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Supplier: Embedded Logic Solutions

Distribution: Australia & New Zealand

Location: Parramatta, NSW

Customers: Dept of Defence, Sydney University

Trade With Confidence. The supplier of this item is approved as a Verified Supplier. Business registration, contact details and locations have been verified. Embedded Logic Solutions are also proudly displaying these credentials:

Established:

2004

Employees:

1-5

Customers:

Dept of Defence, Sydney University

Memberships:

Surface Mount and Circuit Board Association (SMCBA

Distribution:

Australia & New Zealand

Location:

Parramatta , NSW